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MCP46XX PICTAIL? PLUS
DAUGHTER BOARD USER ’S GUIDE
Table of Contents
Preface ........................................................................................................................... 1
Introduction............................................................................................................ 1
Document Layout .................................................................................................. 1
Conventions Used in this Guide ............................................................................ 2
Recommended Reading........................................................................................ 3
The Microchip Web Site ........................................................................................ 3
Customer Support ................................................................................................. 3
Document Revision History ................................................................................... 3
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 5
1.2 What is the MCP46XX PICtail? Plus Daughter Board? ................................ 6
1.3 What the MCP46XX PICtail? Plus Daughter Board Kit includes .................. 7
Chapter 2. Installation and Operation
2.1 Introduction ..................................................................................................... 9
2.2 Features ......................................................................................................... 9
2.3 Getting Started ............................................................................................. 10
2.4 MCP46XX PICtail? Plus Daughter Board Demos ....................................... 14
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 27
A.2 Schematics and PCB Layout ....................................................................... 27
A.3 Board - Schematic ..................................................................................... 28
A.4 Board – Top Silk-Screen Layer .................................................................... 29
A.5 Board – Top Components and Silk-Screen .............................................. 30
A.6 Board – Ground Layer ................................................................................. 31
A.7 Board – Power Layer ................................................................................... 32
A.8 Board – Bottom Layer .............................................................................. 33
Appendix B. Bill Of Materials (BOM)
B.1 Bill Of Materials (BOM) ................................................................................ 35
Appendix C. Board Testing
C.1 Introduction .................................................................................................. 37
C.2 What is Tested ............................................................................................. 38
C.3 What is Not Tested ...................................................................................... 38
Worldwide Sales and Service .................................................................................... 40
? 2009 Microchip Technology Inc.
DS51804A-page iii
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